FR4 and MCPCB (Metal Core Printed Circuit Board) are different types of printed circuit boards, and their main differences lie in their construction and materials.

1. FR4:

• Material: FR4 is a type of electrical-grade laminate made from woven fiberglass cloth impregnated with epoxy resin. The name "FR4" stands for Flame Retardant 4, indicating its fire-resistant properties.

• Construction: FR4 boards typically have a layered structure with copper traces and planes sandwiched between layers of FR4 material. These boards are widely used in various electronic applications due to their cost-effectiveness and versatility.

• Applications: FR4 is commonly used for a broad range of electronic devices, including consumer electronics, telecommunications equipment, and general-purpose printed circuit boards.

2. MCPCB (Metal Core Printed Circuit Board):

• Material: MCPCB has a metal core, usually made of aluminum or copper, instead of a fiberglass core like FR4. The metal core provides better thermal conductivity, making MCPCBs suitable for applications requiring efficient heat dissipation.

• Construction: MCPCBs have a metal layer that acts as a heat sink, helping to dissipate heat generated by electronic components. The metal core is typically laminated with a layer of dielectric material (e.g., thermally conductive insulating material) on which the circuit traces are placed.

• Applications: MCPCBs are used in applications where effective thermal management is crucial, such as high-power LED lighting, power electronics, and devices that generate significant heat.

In summary, the key difference between FR4 and MCPCB lies in their core material and thermal properties. FR4 is a standard laminate material with good electrical insulation properties, while MCPCB incorporates a metal core for enhanced thermal conductivity, making it suitable for applications where efficient heat dissipation is essential. The choice between FR4 and MCPCB depends on the specific requirements of the electronic device or application.